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| ECG012 0.1 Watt, High Linearity InGaP HBT Amplifier The Communications Edge TM Product Information Product Features * 60 - 2500 MHz * +20 dBm P1dB * +36 dBm Output IP3 * 14 dB Gain @ 900 MHz * 12.5 dB Gain @ 1900 MHz * Single Positive Supply (+3V) * Available in a lead-free / green SOT-89 Package Style Product Description The ECG012 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve high performance across a broad range with +36 dBm OIP3 and +20 dBm of compressed 1dB power. It is housed in a lead-free/green/RoHScompliant SOT-89 SMT package. All devices are 100% RF and DC tested. The ECG012 is targeted for use as a driver amplifier in wireless infrastructure where high linearity and medium power is required. An internal active bias allows the ECG012 to maintain high linearity over temperature and operate directly off a single +3 V supply. This combination makes the device an excellent candidate for transceiver line cards in current and next generation multi-carrier 3G base stations. Functional Diagram GND 4 1 RF IN 2 GND 3 RF OUT Applications * * * * Final stage amplifiers for Repeaters Mobile Infrastructure CATV / DBS Defense / Homeland Security Function Input Output/Bias Ground Pin No. 1 3 2, 4 Specifications (1) Parameters Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) IS-95A Channel Power @ -45 dBc ACPR Typical Performance (3) Units MHz MHz dB dB dB dBm dBm dBm dB mA V 65 Min 60 11 Typ 1900 12.5 15 10 +20 +36 +13 4.9 100 +3 Max 2500 Parameters Frequency S21 - Gain S11 - Input R.L. S22 - Output R.L. Output P1dB Output IP3 Noise Figure Supply Bias Units MHz dB dB dB dBm dBm dB Typical 900 1900 2140 14 12.5 11.5 -14 -15 -15 -10 -10 -10 +20 +20 +20 +35 +36 +36 4.7 4.9 5.4 +3 V @ 100 mA Noise Figure Operating Current Range Device Voltage 145 3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +3 V, I = 100 mA, +25 C 1. Test conditions unless otherwise noted: 25 C, Vsupply = +3 V, in a tuned application circuit. 2. 3OIP measured with two tones at an output power of +6 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature RF Input Power (continuous) Device Voltage Device Current Junction Temperature Rating -40 to +85 C -65 to +150 C +15 dBm +6 V 220 mA +250 C Ordering Information Part No. ECG012B-G Description 0.1 Watt, High Linearity InGaP HBT Amplifier (lead-free/green/RoHS-compliant SOT-89 Pkg) ECG012B-PCB900 900 MHz Evaluation Board ECG012B-PCB1900 1900 MHz Evaluation Board ECG012B-PCB2140 2140 MHz Evaluation Board Specifications and information are subject to change without notice Operation of this device above any of these parameters may cause permanent damage. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 1 of 4 October 2006 ECG012 0.1 Watt, High Linearity InGaP HBT Amplifier The Communications Edge TM Product Information Typical Device Data S-Parameters (Vcc = +3 V, Icc = 100 mA, T = 25 C, unmatched 50 ohm system) S11 0. S22 Swp Max 3000MHz 6 0. 1.0 1.0 Gain / Maximum Stable Gain 30 25 0 .2 0. 4 Swp Max 3000MHz 2. 0 0.8 6 2. 0 0 3. 0 .8 0. 4 0 3. 4. 0 0 4. 5.0 0.2 0 5. 20 Gain (dB) 15 0 10.0 10.0 10.0 10 5 0 0 1000 Frequency (MHz) 2000 3000 .0 .6 -0 .8 -0 . -0 Swp Min 50MHz - 0.8 .0 -2 -2 6 -1.0 Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance plots are shown from 50 - 3000 MHz, with markers placed at 0.5 - 3.0 GHz in 0.5 GHz increments. S-Parameters (Vcc = +3 V, Icc = 100 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) 50 -6.10 -155.37 20.62 150.95 -25.48 18.56 -8.19 250 -3.49 -176.62 14.94 140.53 -23.11 6.69 -5.84 500 -3.10 174.48 13.45 129.49 -22.77 5.89 -5.64 750 -2.96 167.11 12.26 115.68 -22.45 3.33 -5.43 1000 -2.79 160.22 11.17 102.37 -22.24 1.71 -5.27 1250 -2.64 153.20 10.12 89.48 -21.89 -0.69 -5.06 1500 -2.55 146.05 9.07 78.22 -21.32 -2.91 -5.01 1750 -2.44 138.76 8.18 67.48 -21.09 -5.27 -4.84 2000 -2.49 132.13 7.30 57.62 -20.45 -7.61 -4.77 2250 -2.39 125.66 6.45 48.01 -20.33 -11.25 -4.69 2500 -2.35 119.11 5.69 39.53 -19.88 -16.63 -4.68 2750 -2.28 111.83 4.98 30.50 -19.58 -18.56 -4.70 3000 -2.29 104.87 4.30 21.43 -18.98 -24.51 -4.54 Device S-parameters are available for download off of the website at: http://www.wj.com S22 (ang) -109.32 -166.90 178.74 170.66 162.86 156.23 149.29 142.22 135.81 128.87 122.52 115.41 108.72 Application Circuit PC Board Layout Circuit Board Material: .014" Getek, 4 layers (other layers added for rigidity), .062" total thickness, 1 oz copper Microstrip line details: width = .026", spacing = .026" Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 2 of 4 October 2006 -1.0 - . -0 4 .4 -0 Swp Min 50MHz -5. 0 -4 .0 3. 0 -5. 0 - 0. 2 -0. 2 -10.0 -10.0 DB(|S(2,1)|) DB(GMax()) 10.0 0.4 0.6 0.8 1.0 2.0 3.0 4.0 5.0 0.2 0.2 0.4 0.6 0.8 1.0 2.0 3.0 4.0 5.0 0 -4 .0 -3 .0 ECG012 0.1 Watt, High Linearity InGaP HBT Amplifier Typical RF Performance Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output IP3 (+6 dBm / tone, 1 MHz spacing) The Communications Edge TM Product Information 900 MHz Application Circuit (ECG012B-PCB900) Vcc = +3 V All passive components are of size 0603 unless otherwise noted. The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. RES ID=R1 RES R=820 Ohm ID=L2 R=0 Ohm 900 MHz 14 dB -14 dB -10 dB +35 dBm +20 dBm 4.7 dB +3 V 100 mA CAP ID=C1 C=100000 pF size 1206 CAP ID=C2 C=56 pF DIODE1 ID=D1 5.6 V IND ID=L1 L=33 nH size 0603 CAP ID=C3 C=1000 pF size 0805 CAP ID=C5 C=56 pF PORT P=2 Z=50 Ohm Output P1dB Noise Figure Supply Voltage Supply Current PORT P=1 Z=50 Ohm CAP ID=C4 C=56 pF CAP ID=C7 C=5.6 pF SUBCKT ID=U1 NET="ECG012" C7 should be placed at the silk screen marker 'F' on the WJ evaluation board. The capacitor should be placed 13.7@ 0.9GHz from pin 1 of the ECG012 RES ID=L3 R=0 Ohm CAP ID=C9 C=1 pF C9 should be placed between silk screen markers '8' and '9' on the WJ evaluation board. The capacitor should be placed 19 @ 0.9GHz from pin 3 of the ECG012. Measured parameters were taken at 25 C. 1900 MHz Application Circuit (ECG012B-PCB1900) Typical RF Performance Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output IP3 (+6 dBm / tone, 1 MHz spacing) Vcc = +3 V All passive components are of size 0603 unless otherwise noted. The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. 1900 MHz 12.5 dB -15 dB -10 dB +36 dBm +20 dBm 4.9 dB +3 V 100 mA CAP ID=C1 C=100000 pF size 1206 CAP ID=C2 C=56 pF CAP ID=C3 C=1000 pF IND ID=L1 L=18 nH RES ID=L3 R=0 Ohm size 0805 CAP ID=C5 C=56 pF PORT P=2 Z=50 Ohm DIODE1 ID=D1 5.6 V PORT P=1 Z=50 Ohm CAP ID=C4 C=56 pF Output P1dB Noise Figure Supply Voltage Supply Current RES ID=L2 R=0 Ohm RES ID=R1 R=820 Ohm CAP ID=C7 C=2.4 pF C7 should be placed at the silk screen marker 'A' on the WJ evaluation board. The capacitor should be placed 4.6@ 1.9GHz from pin 1 of the ECG012 SUBCKT ID=U1 NET="ECG012" CAP ID=C9 C=1.2 pF C9 should be placed at silk screen marker '7' on the WJ evaluation board. The capacitor should be placed 34 @ 1.9GHz from pin 3 of the ECG012. Measured parameters were taken at 25 C. 2140 MHz Application Circuit (ECG012B-PCB2140) Typical RF Performance Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output IP3 (+6 dBm / tone, 1 MHz spacing) Vcc = +3 V All passive components are of size 0603 unless otherwise noted. The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. Component R1 is shown in the silkscreen but is not used for this configuration. L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. RES CAP ID=R1 PORT ID=C4 R=820 Ohm P=1 C=56 pF Z=50 Ohm 2140 MHz 11.5 dB -15 dB -10 dB +34 dBm +20 dBm 5.4 dB +3 V 100 mA CAP ID=C1 C=100000 pF size 1206 CAP ID=C2 C=56 pF CAP ID=C3 C=1000 pF IND ID=L1 L=18 nH size 0805 CAP ID=C5 C=56 pF PORT P=2 Z=50 Ohm DIODE1 ID=D1 5.6 V Output P1dB Noise Figure Supply Voltage Supply Current CAP ID=C6 C=1.5 pF CAP ID=L2 C=2 pF SUBCKT ID=U1 NET="ECG012" RES ID=L3 R=0 Ohm CAP ID=C9 C=.8 pF Measured parameters were taken at 25 C. C6 should be placed between silk screen markers 'E' & 'F' on the WJ evaluation board. The capacitor should be placed 28.9 @ 2.14GHz from pin 1 of the ECG012 C9 should be placed at silk screen marker '3' on the WJ evaluation board. The capacitor should be placed 14.2 @ 2.14GHz from pin 3 of the ECG012. Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 3 of 4 October 2006 ECG012 0.1 Watt, High Linearity InGaP HBT Amplifier The Communications Edge TM Product Information ECG012B-G Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Product Marking The component will be marked with an "E012G" designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is marked with an "E012" designator followed by an alphanumeric lot code. Tape and reel specification for this part is located on the website in the "Application Notes" section. ESD / MSL Information Land Pattern ESD Rating: Value: Test: Standard: Class 1B Passes between 500 and 1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tj (2) MTTF vs. GND Tab Temperature 10000 1000 100 10 1 60 70 80 90 100 Tab Temperature (C) 110 120 Rating -40 to +85 C 149 C / W 130 C Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85 C. 2. This corresponds to the typical biasing condition of +3V, 100 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C. Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 4 of 4 October 2006 |
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